Single side polishing machine for 300mm wafers. Fully automates all processes: wafer removal from cassette, polishing and storage into other cassettes. Compact machine allows effective use of clean room. 2 wafers can be polished simultaneously with 2 toprings.

Vendor: Fujikoshi Machinery Corp

The identical wheel can make T or R wafer edge shape.
Also this machine can correct edge shape after lapping.
Wheel setup is easy requiring only changing of recipe settings.
Vertical resin-bonded wheel reduces grinding marks and keeps surface roughness to a minimal and Copper-less processing.

Vendor: EMTEC Co.,Ltd

Slurry-free edge polishing after chamfering, using rubber wheels.
T or R shape can be easily setup by simply changing the recipe settings.
Parameters such as wheel grain, floating load, wheel speed and number of wafer rotations are regulated to ensure higher polishing control.

Vendor: EMTEC Co.,Ltd

Highly accurate and efficient single side polishing machine for 8-inch wafers mounted on base plate. The speed of turntable is changeable in the range of 0 to 50rpm by dial. Cushion start device protects workpieces from damaging.

Vendor: Fujikoshi Machinery Corp

Compact double side polishing machine for 12-inch and 8-inch wafers. 3-side open frame raises work efficiency.
Easy-to-see touch panel allows smooth operation. Rotating guide roller stabilizes upper table rotation, lowering the position of the loading point.

Vendor: Fujikoshi Machinery Corp