Rotating reticle stocker with high storage efficiency for Class 1 environment. Customized unit sizing and storage capacity to meet Customer-specific needs. PC-controlled functional recticle carry-in/out and log management. CIM-link enables in-factory recticle management.

Vendor: Timec Co.,Ltd.

Fully automatic single side polishing machine for 8-inch wafers.
Wafers are polished to a high-precision finish.
Fully automatic processing from loading - polishing to unloading.
For greater processing efficiency, two-cassette side-by-side simultaneous polishing machine.

Vendor:Fujikoshi Machinery Corp.

Transfers wafers from process cassette to shipping box (PROTOS®).
Wafers are packed alternately with special spacers inside to prevent chipping and breakage.
The machine can also be used to unpack wafers from the box to the cassette.

Vendor: Himec Co.Ltd.

Non-chemical spin cleaning machine. Effectively removes dicing dust and other particle adhesions using pure/ultra pure water. Small footprint and with versatile functions, this machine can be used as a device for removing burrs from the wafer surface after each fabrication process.

Vendor: EMTEC Co.,Ltd

Uses data probed for 12-inch wafers, to pick up only acceptable chips and sort by class. High-speed mount and downsizing to 8-inch wafers. Convert to existing 8-inch bonding line facilities for improved productivity. Chips are stored in trays and map data is retrievable via LAN communication. .

Vendor: EMTEC Co.,Ltd